Physics-informed thermal surrogate benchmark for 3D/2.5D IC packaging — PINN, FNO/WHNO, PI-DeepONet, and autoregressive operators trained on real 3D-ICE ground truth across 8 geometries (single-die, TSV stacks, chiplets, CoWoS+HBM).
pytorch pinn 3d-ic explainable-ai foundation-models chiplet cowos operator-learning deeponet fourier-neural-operator ic-packaging chip-thermal-anlysis
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Updated
Jul 2, 2026 - Python